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DTM65536B
2 GB - 240-Pin DDR2 Low Power FB-DIMM
Document 06038, Revision A, 29-Sep-09, Dataram Corporation © 2010 Page 8
NOTES FOR RECEIVER INPUT SPECIFICATIONS:
1. Specified at the package pins into a timing and voltage compliant test setup. Note that signal levels at the pad are lower than at
the pin.
2. Single-ended voltages below that value that are simultaneously detected on D+ and D- are interpreted as the Electrical Idle
condition. Worst-case margins are determined by comparing EI levels with common mode levels during normal operation for the
case with transmitter using small voltage swing (see RX Single-ended Electrical Idle Levels and RX Common Mode Levels).
3. Multiple lanes need to detect the EI condition before the device can act upon the EI detection.
4. Specified at the package pins into a timing and voltage compliance test setup.
5. This specification, considered with V
TX-IDLE-SE-DC, implies a maximum 15mV single-ended DC offset between TX and RX pins
during the electrical idle condition. This in turn allows a ground offset between adjacent FB-DIMM of 26mV when worstcase
termination resistance matching is considered.
6. The single-pulse mask provides sufficient symbol energy for reliable RX reception. Each symbol complies with both the single-
pulse mask and the cumulative eye mask (see RX Single-Pulse Min Width and Amplitude Mask, Pulse Shifted Early, and RX Single-
Pulse Min Width and Amplitude Mask, Pulse Shifted Late).
7. The relative amplitude ratio limit between adjacent symbols prevents excessive inter-symbol interference in the Rx. Each symbol
must comply with the peak amplitude ratio with regard to both the preceding and subsequent symbols (see RX Maximum Adjacent
Symbol Amplitude).
8. This number does not include the effects of SSC or reference clock jitter.
9. This number includes setup and hold of the RX sampling flop.
10. Defined as the dual-dirac deterministic timing error as described in Section 4.2.2 of the JEDEC FB-DIMM High-Speed
Differential PTP Link Draft Spec, rev 0.8.
11. Allows for 15mV DC offset between transmit and receive devices. 12. The received differential signal satisfies both this ratio as
well as the absolute maximum AC peak-to-peak common mode specification. For example, if V
RX-DIFFp-p is 200mV,
the maximum AC peak-to-peak common mode is the lesser of (200 mV * 0.45 = 90mV) and V
RX-CM-ACp-p.
13. The termination small signal resistance; tolerance across voltages from 100mV to 400mV shall not exceed ±5∧ with regard to
the average of the values measured at 100mV and at 400mV for that pin.
14. This number represents the lane-to-lane skew between TX and RX pins and does not include the transmitter output skew from
the component driving the signal to the receiver. This is one component of the end-to-end channel skew in the AMB specification.
15. Measured from the reference clock edge to the center of the input eye. This specification is met across specified voltage and
temperature ranges. Drift rate of change is significantly below the tracking capability of the receiver.
16. This bandwidth number assumes the specified minimum data transition density. Maximum jitter at 0.2MHz is 0.05UI.
17. The specified time includes the time required to forward the EI entry condition.
18. BER per differential lane.
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